JP2956701B

PROBLEM TO BE SOLVED: To accurately perform lead forming of outer lead by positioning a resin sealed semiconductor device at an accurate machining/fixing position. SOLUTION: A resin sealed semiconductor device is arranged at a bending position along a supporting table 31 and adjusted automatically to an accurate machining/fixing position, by pressing a pair of inclining faces 60, 61 of a holder 55 against side faces 4a, 4b at a base part 4 of a resin sealed body 2. Subsequently, an outer lead 3 is bent by means of a bending die 33. The interval between the outer lead 3 and the side faces 4a, 4b at the base part 4 of the resin sealed body 2 including the outer lead 3 is constant at all times, and since the holder 55 abuts against only the base part on the underside of the resin sealed body 2, the side faces 4a, 4b will not shift from the outer lead 3, even if the base part 4 of the resin sealed body 2 and a cover part 28b are molded, while being shifted to the arranging direction of the outer lead 3.