JP2916192B

Polyamides suitable for use as hot melt adhesives, eg with polyepoxide resins can be prepared from 1. one or more polyoxyalkylene polyamines having an average molecular weight of 148 to 500, 2. a dimer acid having at least 36 carbon atoms, and 3. a short chain dicarboxylic acid. The materials can be...

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Bibliographische Detailangaben
Hauptverfasser:	JOOJI FUIRITSUPU SUPERANZA, UEIIYAN SUU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Polyamides suitable for use as hot melt adhesives, eg with polyepoxide resins can be prepared from 1. one or more polyoxyalkylene polyamines having an average molecular weight of 148 to 500, 2. a dimer acid having at least 36 carbon atoms, and 3. a short chain dicarboxylic acid. The materials can be reacted at 170 to 280C in a mole ratio, total amine to acid, of 0.8:1.0 to 1.25:1.0. The softening point and shear strength of the adhesive can be adjusted by adjusting the ratio of the reacting materials.