JP2875799B
A shielded module support structure for printed circuit boards 2 can be inserted on guide rail 7 and having electrical or electronic components has two parallel side walls 3 and at least four module rails 4 for bearing the guide rails 7. The module rails are anodized aluminum or an anodized aluminum...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A shielded module support structure for printed circuit boards 2 can be inserted on guide rail 7 and having electrical or electronic components has two parallel side walls 3 and at least four module rails 4 for bearing the guide rails 7. The module rails are anodized aluminum or an anodized aluminum alloy and have, at the front side, at least one seating surface 12 for one or more front plates 9, to improve electrical conductivity, sections of the module rails 4 are freed from the anodized layer. This can be done by removal of protrusions 18 by processes such as mechanical milling. For improved contacting, resilient contact bands 19 may be snapped onto the rails 4 into engagement with the bared seating surfaces 12. The resilient contact bands include sharp-edged breakouts 22 for conductive engagement with plates 9 for effecting a shielded enclosure about the circuit boards 2. |
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