JP2868384B

The present invention provides a method of measuring the depth of a dicing groove, employing an ultrasonic detector, capable of measuring the depth of the groove in a high accuracy when the groove is cut in a full-cut mode. A method according to the present invention employes an ultrasonic detector...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA HODAKA, NAKAMURA MASAHARU
Format:	Patent
Sprache:	eng
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The present invention provides a method of measuring the depth of a dicing groove, employing an ultrasonic detector, capable of measuring the depth of the groove in a high accuracy when the groove is cut in a full-cut mode. A method according to the present invention employes an ultrasonic detector which emits ultrasonic waves, measures the time interval between the emission of the ultrasonic waves and the return of their echo, the phase difference between the emitted ultrasonic waves and the reflected ultrasonic waves, or both the time interval and the phase difference to measure the depth of the groove. The method of the present invention is featured by determining the depth of the dicing groove on the basis of the depth of the groove formed in an exposed area of the adhesive sheet not occupied by the workpiece.