JP2859565B

An epoxide-free thermosetting coating system comprises: (i) a binder resin based on an OH-terminated polyester resin(s) (I) with an OH no. of 20-200 mg KOH/g and Tg of at least 40 degrees C; (ii) a polyisocyanate(s) (II) contg. COOH gps. with at least 2 reversibly blocked NCO gps./mol. and an acid n...

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Bibliographische Detailangaben
Hauptverfasser:	MANFUREETO HOTSUPE, RUNE JISUREERU, ANDOREASU KAPURAN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	An epoxide-free thermosetting coating system comprises: (i) a binder resin based on an OH-terminated polyester resin(s) (I) with an OH no. of 20-200 mg KOH/g and Tg of at least 40 degrees C; (ii) a polyisocyanate(s) (II) contg. COOH gps. with at least 2 reversibly blocked NCO gps./mol. and an acid no. of 20-150 mg KOH/g; (iii) beta -hydroxyalkyl-amide(s) (III) with at least 2 beta -hydroxyalkylamide gps./mol.; and (iv) opt. other additives depending on its use and processing. Also claimed is a method of producing the system.