JP2843645B

PURPOSE:To drastically shorten the time for laser beam processing by reducing the thickness of a plate by etching and processing the thinned parts by the laser beam processing according to the method for processing the plate. CONSTITUTION:Resists 9, 10 of prescribed patterns P are formed on both fro...

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Bibliographische Detailangaben
Hauptverfasser:	KATO TSUNENORI, HOTSUTA HIDEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE:To drastically shorten the time for laser beam processing by reducing the thickness of a plate by etching and processing the thinned parts by the laser beam processing according to the method for processing the plate. CONSTITUTION:Resists 9, 10 of prescribed patterns P are formed on both front and rear surfaces of the metallic plate 8 having a prescribed thickness. Both surfaces of the metallic plate 8 are chemically etched by as much as the etching depth of the prescribed quantity by using the formed resists 9, 10. The thickness of the metallic plate 8 in the etched parts e1, e2 is, therefore, smaller than the thickness t0 of the other non-processed parts. The etched parts e1, e2 of the reduced thickness are irradiated with the laser beam L. A through-hole is formed in the etched parts e1, e2 of the metallic plate 8 and the etched parts are cut. The resists 9, 10 on both surfaces of the metallic plate 8 are finally removed by peeling, by which a lead frame 1 is produced.