JP2841856B

In an of electronic components mounting apparatus pick-and-place heads are rotated for indexing along a rotary head to pick up electronic components of an electronic components feeding device and the components are mounted on a circuit board, which is positioned on an X-Y table. A moving base is mov...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KASHIWAGI YASUHIRO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In an of electronic components mounting apparatus pick-and-place heads are rotated for indexing along a rotary head to pick up electronic components of an electronic components feeding device and the components are mounted on a circuit board, which is positioned on an X-Y table. A moving base is moved in lateral direction, and the components placed on feeders are supplied to the pick-and-place heads. The moving base is divided into a feeding area and retreat areas, and accommodating areas for accommodating tables are provided near the retreat areas to move the tables reciprocatively between the retreat areas and the feeding areas. The tables hindering this movement are accommodated in the accommodating areas. Therefore, only a desired table is positioned in the feeding area. By moving this table at high speed, the electronic components can be supplied to the pick-and-place heads. When there is no more electronic component on a feeder, the feeder can be exchanged in the accommodating area.