JP2834279B
The present invention relates to hot-melt adhesive coating solutions which contain A) from 5 to 80% by weight of a copolyamide built up from units derived from A1) organic dicarboxylic acids where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 c...
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| creator | HANSU SHUTSUPU HERUMUUTO REEMAN PEETAA HESERU KURAUSU RIINERUTO |
| description | The present invention relates to hot-melt adhesive coating solutions which contain
A) from 5 to 80% by weight of a copolyamide built up from units derived from
A1) organic dicarboxylic acids
where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 carbon atoms,
and
A2) a mixture of diisocyanates comprising
a21) from 20 to 95 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is an aromatic radical having 5 to 25 carbon atoms,
a22) from 5 to 70 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is
or a linear aliphatic radical having 3 to 30 carbon atoms which is substituted by 1 to 3 C1-C4-alkyl groups, and R and R , independently of one another, are each a C1-C4-alkyl group or a hydrogen atom,
a23) from 0 to 20 mol% of a diisocyanate of the formula
OCN-(CH2)y-NCO
where y is an integer in the range from 1 to 20,
and
B) from |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2834279BB2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2834279BB2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2834279BB23</originalsourceid><addsrcrecordid>eNrjZODyCjCyMDYxMrd04mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8QgNTkbGxKgBACnyG4I</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>JP2834279B</title><source>esp@cenet</source><creator>HANSU SHUTSUPU ; HERUMUUTO REEMAN ; PEETAA HESERU ; KURAUSU RIINERUTO</creator><creatorcontrib>HANSU SHUTSUPU ; HERUMUUTO REEMAN ; PEETAA HESERU ; KURAUSU RIINERUTO</creatorcontrib><description>The present invention relates to hot-melt adhesive coating solutions which contain
A) from 5 to 80% by weight of a copolyamide built up from units derived from
A1) organic dicarboxylic acids
where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 carbon atoms,
and
A2) a mixture of diisocyanates comprising
a21) from 20 to 95 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is an aromatic radical having 5 to 25 carbon atoms,
a22) from 5 to 70 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is
or a linear aliphatic radical having 3 to 30 carbon atoms which is substituted by 1 to 3 C1-C4-alkyl groups, and R and R , independently of one another, are each a C1-C4-alkyl group or a hydrogen atom,
a23) from 0 to 20 mol% of a diisocyanate of the formula
OCN-(CH2)y-NCO
where y is an integer in the range from 1 to 20,
and
B) from <0.5 to 30% by weight of a blocked diisocyanate or polyisocyanate,
in an organic solvent or solvent mixture.</description><edition>6</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19981209&DB=EPODOC&CC=JP&NR=2834279B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19981209&DB=EPODOC&CC=JP&NR=2834279B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANSU SHUTSUPU</creatorcontrib><creatorcontrib>HERUMUUTO REEMAN</creatorcontrib><creatorcontrib>PEETAA HESERU</creatorcontrib><creatorcontrib>KURAUSU RIINERUTO</creatorcontrib><title>JP2834279B</title><description>The present invention relates to hot-melt adhesive coating solutions which contain
A) from 5 to 80% by weight of a copolyamide built up from units derived from
A1) organic dicarboxylic acids
where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 carbon atoms,
and
A2) a mixture of diisocyanates comprising
a21) from 20 to 95 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is an aromatic radical having 5 to 25 carbon atoms,
a22) from 5 to 70 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is
or a linear aliphatic radical having 3 to 30 carbon atoms which is substituted by 1 to 3 C1-C4-alkyl groups, and R and R , independently of one another, are each a C1-C4-alkyl group or a hydrogen atom,
a23) from 0 to 20 mol% of a diisocyanate of the formula
OCN-(CH2)y-NCO
where y is an integer in the range from 1 to 20,
and
B) from <0.5 to 30% by weight of a blocked diisocyanate or polyisocyanate,
in an organic solvent or solvent mixture.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODyCjCyMDYxMrd04mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8QgNTkbGxKgBACnyG4I</recordid><startdate>19981209</startdate><enddate>19981209</enddate><creator>HANSU SHUTSUPU</creator><creator>HERUMUUTO REEMAN</creator><creator>PEETAA HESERU</creator><creator>KURAUSU RIINERUTO</creator><scope>EVB</scope></search><sort><creationdate>19981209</creationdate><title>JP2834279B</title><author>HANSU SHUTSUPU ; HERUMUUTO REEMAN ; PEETAA HESERU ; KURAUSU RIINERUTO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2834279BB23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>HANSU SHUTSUPU</creatorcontrib><creatorcontrib>HERUMUUTO REEMAN</creatorcontrib><creatorcontrib>PEETAA HESERU</creatorcontrib><creatorcontrib>KURAUSU RIINERUTO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HANSU SHUTSUPU</au><au>HERUMUUTO REEMAN</au><au>PEETAA HESERU</au><au>KURAUSU RIINERUTO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JP2834279B</title><date>1998-12-09</date><risdate>1998</risdate><abstract>The present invention relates to hot-melt adhesive coating solutions which contain
A) from 5 to 80% by weight of a copolyamide built up from units derived from
A1) organic dicarboxylic acids
where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 carbon atoms,
and
A2) a mixture of diisocyanates comprising
a21) from 20 to 95 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is an aromatic radical having 5 to 25 carbon atoms,
a22) from 5 to 70 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is
or a linear aliphatic radical having 3 to 30 carbon atoms which is substituted by 1 to 3 C1-C4-alkyl groups, and R and R , independently of one another, are each a C1-C4-alkyl group or a hydrogen atom,
a23) from 0 to 20 mol% of a diisocyanate of the formula
OCN-(CH2)y-NCO
where y is an integer in the range from 1 to 20,
and
B) from <0.5 to 30% by weight of a blocked diisocyanate or polyisocyanate,
in an organic solvent or solvent mixture.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | JP2834279B |
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