JP2834279B

The present invention relates to hot-melt adhesive coating solutions which contain A) from 5 to 80% by weight of a copolyamide built up from units derived from A1) organic dicarboxylic acids where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HANSU SHUTSUPU, HERUMUUTO REEMAN, PEETAA HESERU, KURAUSU RIINERUTO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to hot-melt adhesive coating solutions which contain A) from 5 to 80% by weight of a copolyamide built up from units derived from A1) organic dicarboxylic acids where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 carbon atoms, and A2) a mixture of diisocyanates comprising a21) from 20 to 95 mol% of a diisocyanate of the formula OCN-R -NCO where R is an aromatic radical having 5 to 25 carbon atoms, a22) from 5 to 70 mol% of a diisocyanate of the formula OCN-R -NCO where R is or a linear aliphatic radical having 3 to 30 carbon atoms which is substituted by 1 to 3 C1-C4-alkyl groups, and R and R , independently of one another, are each a C1-C4-alkyl group or a hydrogen atom, a23) from 0 to 20 mol% of a diisocyanate of the formula OCN-(CH2)y-NCO where y is an integer in the range from 1 to 20, and B) from