JP2796343B

PURPOSE:To prevent tab short-circuit, chip short-circuit or short-circuit between wires due to film damage caused by thermal deterioration of a coating film by a method wherein the coating film of a covered wire is specific heat-resistant polyurethane while an end of the covered wire is connected to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WATANABE HIROSHI, TANIMOTO MICHIO, PPONMA KYOSHI, KOIKE SHUNJI, OKIKAWA SUSUMU, KANEDA TAKESHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To prevent tab short-circuit, chip short-circuit or short-circuit between wires due to film damage caused by thermal deterioration of a coating film by a method wherein the coating film of a covered wire is specific heat-resistant polyurethane while an end of the covered wire is connected to an external terminal of a semiconductor chip and the other end is connected to a lead. CONSTITUTION:An insulating coating film 5B of a coating wire 5 comprises heat-resistant urethane wherein polyol component and isocyanate are reacted and a structure unit induced from terephthalic acid is contained in a molecular skeleton. An end of the covered wire 5 is connected to an external terminal 2C of a semiconductor chip 2 and the other end is connected to a lead 3. Since film damage of a coating film comprising heat-resistant polyurethane which is caused by thermal deterioration can be thus prevented, electrical short-circuit problems such as tab short-circuit, chip short-circuit and short-circuit between wires can be prevented..