JP2772086B

PURPOSE:To prevent aluminum dust adhering to a probe from falling on a wafer owing to vibration produced upon indexing by forcing the wafer and a probe card to be stationary and indexing a test head side to measure an IC chip successively. CONSTITUTION:An IC chip is tested by fixing a wafer 6 on a s...

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1. Verfasser: SAKAI IWAO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To prevent aluminum dust adhering to a probe from falling on a wafer owing to vibration produced upon indexing by forcing the wafer and a probe card to be stationary and indexing a test head side to measure an IC chip successively. CONSTITUTION:An IC chip is tested by fixing a wafer 6 on a stage 7, aligning a probe card 4 and the water 6, and bringing into contact a variable test head contactor 3 provided on the side of a variable test head and a probe card contactor 2 provided above the probe card 4. After the testing, the variable test head 1 is indexed to the successive IC chip. At this time, the variable test head 1 and a tester head 8 have been connected through wiring. Hereby, aluminum dust adhering to a probe can be prevented from falling on the wafer owing to vibration produced upon indexing.