JP2765832B

PURPOSE:To contrive to improve the production efficiency of an optical semiconductor element without exerting adverse effect on the light characteristics of the element by a method wherein, after an optical filter and a light-transmitting resin are directly adhered without using a bonding agent, both are subjected to molding processing as an integral matter. CONSTITUTION:A light-transmitting member 7 is arranged at a proper place of a molding die, an optical semiconductor device main part 4 is made to oppose to the member 7 and moreover, with a light-transmitting resin 6 injected in the molding die to adhere to the member 7, the main part 4 is sealed. That is, the member 7 and the resin 6 are directly bonded together without using a bonding agent. Accordingly, to be worried about a selection of the bonding agent is eliminated and to consider bubbles to generate in it is eliminated and moreover, there is no need to consider a positioning precision associated with the bonding agent as well. Thereby, adverse effect is never exerted on the light characteristics of an optical semiconductor element and the production efficiency of the element is improved.