JP2762526B

PURPOSE:To apply a slight load when a bonding tool is brought into contact with a bonding object and to reduce damage to an area immediately below a bonding section and a periphery thereof by changing a load applied to the bonding tool during contact bonding with the bonding tool. CONSTITUTION:A bon...

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Bibliographische Detailangaben

1. Verfasser:	ONOZAWA TOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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