JP2762526B

PURPOSE:To apply a slight load when a bonding tool is brought into contact with a bonding object and to reduce damage to an area immediately below a bonding section and a periphery thereof by changing a load applied to the bonding tool during contact bonding with the bonding tool. CONSTITUTION:A bonding tool lowers rapidly to a specified height h2, and then switches to a low speed to come into contact with a bonding object at a height h1. A load applied to the bonding tool switches from a hold load w0 to a contact load w1 (for example, from 2gm. to 30gm.) delayed DELTAt1 (for example, 1 to 5 milliseconds) behind a switching time t0 to a low speed at h2. Then, a load applied to the bonding tool switches from w1 to an original bonding load w2 at t3 which is delayed DELTAt2 behind a time t2 when the bonding tool comes into contact with the bonding object. Thereby, general impact applied to the bonding object can be relaxed.