JP2746224B

A resin encapsulated semiconductor device comprises a lead frame having a center portion, a plurality of inner leads extending radially outward from the center portion, a plurality of hanger leads extending radially outward from the center portion, and a plurality of outer leads each continuous to a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IINO KAZUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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