JP2746224B

A resin encapsulated semiconductor device comprises a lead frame having a center portion, a plurality of inner leads extending radially outward from the center portion, a plurality of hanger leads extending radially outward from the center portion, and a plurality of outer leads each continuous to a corresponding one of the inner leads and extending radially outward from the corresponding one of the inner leads. At a position substantially corresponding to a periphery contour of a semiconductor chip when the semiconductor chip is put on the center portion of the lead frame, each of the inner leads is cut off and divided into an inner lead inside portion and an inner lead outside portion which are separated from each other. The semiconductor chip is bonded on an island formed of the center portion of the lead frame and the inner lead inside portion of each inner lead. Each inner lead outside portion is electrically connected to a corresponding external electrode of the semiconductor chip. The semiconductor chip, the island, the hanger leads and the inner lead outside portions are encapsulated with a molding resin.