JP2650887B
PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being damaged by scratching, etc., so as to increase the yield of the wafer by balancing the wafer at the time of clamping the wafer. SOLUTION: A semiconductor wafer clamping device has a plurality of clamps 21 each of which is provided wit...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | GO ZAIEI YANAGI SEIKO |
| description | PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being damaged by scratching, etc., so as to increase the yield of the wafer by balancing the wafer at the time of clamping the wafer. SOLUTION: A semiconductor wafer clamping device has a plurality of clamps 21 each of which is provided with a vertical clamp shaft 22, a plurality of air cylinders 23-26 which pressurize the shaft 22, and an air supply line which can simultaneously supply air supplied from an air source to the cylinders 23-26. Since air is simultaneously supplied to the air cylinders 23-26, the clamps 21 can simultaneously clamp a wafer 20 and, since the cylinders 23-26 are connected to the shafts 22 fixed to the clamps 21 in one body, the operations of the cylinders 23-26 are directly transmitted to the clamps 21. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2650887BB2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2650887BB2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2650887BB23</originalsourceid><addsrcrecordid>eNrjZODyCjAyMzWwsDB34mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8QgNTkbGxKgBACp3G4U</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>JP2650887B</title><source>esp@cenet</source><creator>GO ZAIEI ; YANAGI SEIKO</creator><creatorcontrib>GO ZAIEI ; YANAGI SEIKO</creatorcontrib><description>PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being damaged by scratching, etc., so as to increase the yield of the wafer by balancing the wafer at the time of clamping the wafer. SOLUTION: A semiconductor wafer clamping device has a plurality of clamps 21 each of which is provided with a vertical clamp shaft 22, a plurality of air cylinders 23-26 which pressurize the shaft 22, and an air supply line which can simultaneously supply air supplied from an air source to the cylinders 23-26. Since air is simultaneously supplied to the air cylinders 23-26, the clamps 21 can simultaneously clamp a wafer 20 and, since the cylinders 23-26 are connected to the shafts 22 fixed to the clamps 21 in one body, the operations of the cylinders 23-26 are directly transmitted to the clamps 21.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT ; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970910&DB=EPODOC&CC=JP&NR=2650887B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970910&DB=EPODOC&CC=JP&NR=2650887B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GO ZAIEI</creatorcontrib><creatorcontrib>YANAGI SEIKO</creatorcontrib><title>JP2650887B</title><description>PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being damaged by scratching, etc., so as to increase the yield of the wafer by balancing the wafer at the time of clamping the wafer. SOLUTION: A semiconductor wafer clamping device has a plurality of clamps 21 each of which is provided with a vertical clamp shaft 22, a plurality of air cylinders 23-26 which pressurize the shaft 22, and an air supply line which can simultaneously supply air supplied from an air source to the cylinders 23-26. Since air is simultaneously supplied to the air cylinders 23-26, the clamps 21 can simultaneously clamp a wafer 20 and, since the cylinders 23-26 are connected to the shafts 22 fixed to the clamps 21 in one body, the operations of the cylinders 23-26 are directly transmitted to the clamps 21.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</subject><subject>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODyCjAyMzWwsDB34mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8QgNTkbGxKgBACp3G4U</recordid><startdate>19970910</startdate><enddate>19970910</enddate><creator>GO ZAIEI</creator><creator>YANAGI SEIKO</creator><scope>EVB</scope></search><sort><creationdate>19970910</creationdate><title>JP2650887B</title><author>GO ZAIEI ; YANAGI SEIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2650887BB23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</topic><topic>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>GO ZAIEI</creatorcontrib><creatorcontrib>YANAGI SEIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GO ZAIEI</au><au>YANAGI SEIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JP2650887B</title><date>1997-09-10</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being damaged by scratching, etc., so as to increase the yield of the wafer by balancing the wafer at the time of clamping the wafer. SOLUTION: A semiconductor wafer clamping device has a plurality of clamps 21 each of which is provided with a vertical clamp shaft 22, a plurality of air cylinders 23-26 which pressurize the shaft 22, and an air supply line which can simultaneously supply air supplied from an air source to the cylinders 23-26. Since air is simultaneously supplied to the air cylinders 23-26, the clamps 21 can simultaneously clamp a wafer 20 and, since the cylinders 23-26 are connected to the shafts 22 fixed to the clamps 21 in one body, the operations of the cylinders 23-26 are directly transmitted to the clamps 21.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2650887BB2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | JP2650887B |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T01%3A46%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GO%20ZAIEI&rft.date=1997-09-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2650887BB2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |