JP2650887B

PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being damaged by scratching, etc., so as to increase the yield of the wafer by balancing the wafer at the time of clamping the wafer. SOLUTION: A semiconductor wafer clamping device has a plurality of clamps 21 each of which is provided with a vertical clamp shaft 22, a plurality of air cylinders 23-26 which pressurize the shaft 22, and an air supply line which can simultaneously supply air supplied from an air source to the cylinders 23-26. Since air is simultaneously supplied to the air cylinders 23-26, the clamps 21 can simultaneously clamp a wafer 20 and, since the cylinders 23-26 are connected to the shafts 22 fixed to the clamps 21 in one body, the operations of the cylinders 23-26 are directly transmitted to the clamps 21.