JP2546423B

PURPOSE:To obtain an adhesive composition having excellent shelf stability and precuring properties by dispersing a mixture of two kinds of microcapsule type thermally curing agents into an adhesive having reactivity with the curing agents. CONSTITUTION:A thermally activation type microcapsule curin...

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Bibliographische Detailangaben
Hauptverfasser: GOTO YASUSHI, YAMAGUCHI YUTAKA, TSUKAGOSHI ISAO, NAKAJIMA ATSUO, OOTA TOMOHISA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To obtain an adhesive composition having excellent shelf stability and precuring properties by dispersing a mixture of two kinds of microcapsule type thermally curing agents into an adhesive having reactivity with the curing agents. CONSTITUTION:A thermally activation type microcapsule curing agent comprising a curing agent consisting of (A) 5-50wt.% curing agent having an activation temperature shown by a peak temperature in the rate of heating (10 deg.C/minute) of DSC to be below a specific temperature (preferably 80-130 deg.C, especially 90-125'C) and (B) 95-50wt.% curing agent having an activation temperature of >=a specific temperature as a nucleus material, wherein the practical whole surface has a coating film layer, is dispersed into an adhesive such as epoxy- based adhesive having reactivity with the curing agent to give the objective composition.