JP2539124B

A wafer moving equipment, attached to a horizontal moving stage, is composed of (A) a hinge spring (11) of a rotation center connecting with a displacement enlarging part, (B) a displacement enlarging part for rotating a piezoelectric elongating element vertically, (C) a tilting equipment for assemb...

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Bibliographische Detailangaben
Hauptverfasser:	KIN JUNTAI, RI SHOGEN, KIN HOJU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MATERIALS THEREFOR METAL-WORKING NOT OTHERWISE PROVIDED FOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A wafer moving equipment, attached to a horizontal moving stage, is composed of (A) a hinge spring (11) of a rotation center connecting with a displacement enlarging part, (B) a displacement enlarging part for rotating a piezoelectric elongating element vertically, (C) a tilting equipment for assembling the hinge spring, the elongating element and the displacement enlarging part with 180o gap, and (D) a guiding component by assembling the same components of (C) at 90o angle to the moving direction.