JP2532496B

PURPOSE:To facilitate packaging of chips accurately and facilitate batch processing of wirings between electrodes with every chip mounting board as a unit of processing by a method wherein recessed parts for absorbing the difference in chip thickness are provided in the chip mounting board and an ev...

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Bibliographische Detailangaben
1. Verfasser: MINO YOSHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To facilitate packaging of chips accurately and facilitate batch processing of wirings between electrodes with every chip mounting board as a unit of processing by a method wherein recessed parts for absorbing the difference in chip thickness are provided in the chip mounting board and an evaporation wiring method or a printing wiring method is applied. CONSTITUTION:Ultraviolet and heat curing type resin is applied to the whole main surface of a board 1. After chips 3a and 3b are put in the recessed parts 2 of the board 1, a transparent board is put on the main surface of the board and a pressure is applied to the transparent board. Ultraviolet rays are applied to the resin through the transparent board with the transparent board fixed by pressure and, further, the resin in the parts where the ultraviolet rays can not reach is cured by heat. Then the transparent board is removed and, after an insulating film 9 is formed over the whole surface except electrode parts, electrode wirings 12 are formed by an evaporation method or a printing method. With this constitution, the chip mounting board which has the recessed parts absorbs the difference in chip thickness and the inclination of the chip and the step between the chip and the board produced at the time of die-bonding are corrected to keep the surface of the chip and the surface of the board in the same plane and the electrode wirings for mounting can be formed by batch processing with every chip mounting board as a unit of processing by utilizing an evaporation method or a printing method.