SUBSTRATE COOLING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE COOLING SYSTEM, SUBSTRATE PROCESSING DEVICE, AND PROGRAM

To provide a technology that can control the cooling of a substrate appropriately.SOLUTION: A method has the steps for conveying a substrate from a processing chamber to a conveyance chamber after processing the substrate placed in the processing chamber while detecting the temperature with a temper...

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Bibliographische Detailangaben
Hauptverfasser:	SUGISHITA MASASHI, YAMAGUCHI HIDETO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a technology that can control the cooling of a substrate appropriately.SOLUTION: A method has the steps for conveying a substrate from a processing chamber to a conveyance chamber after processing the substrate placed in the processing chamber while detecting the temperature with a temperature sensor attached to a substrate support fixture that supports the substrate and cooling the substrate so that the temperature detected by the temperature sensor is less than or equal to a set temperature in a state where the substrate support fixture is placed in a predetermined position.SELECTED DRAWING: Figure 9 【課題】基板の冷却を適正に制御することができる技術を提供する。【解決手段】基板を支持する基板支持具に取り付けられる温度センサにより温度を検出しつつ処理室に配置される前記基板を処理した後、前記基板を前記処理室から搬送室に搬送する工程と、前記基板支持具が所定の位置に配置された状態で、前記温度センサにより検出される温度が設定温度以下になるように、前記基板を冷却する工程と、を有する。【選択図】図９