WAFER HEATING DEVICE

To provide a wafer heating device that can effectively suppress heat escape from an electrode terminal.SOLUTION: A wafer heating device includes a wafer holder having an upper surface on which a wafer is placed and a lower surface facing the upper surface, a heating element disposed between the uppe...

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Bibliographische Detailangaben
Hauptverfasser:	ITAKURA KATSUHIRO, KITABAYASHI KEIJI, SAKITA SHIGENOBU, KIMURA KOICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a wafer heating device that can effectively suppress heat escape from an electrode terminal.SOLUTION: A wafer heating device includes a wafer holder having an upper surface on which a wafer is placed and a lower surface facing the upper surface, a heating element disposed between the upper and lower surfaces in a plane parallel to the upper surface, and an electrode terminal having an end surface in contact with a portion of the heating element, and at least a portion of the electrode terminal is composed of a porous metal body.SELECTED DRAWING: Figure 1 【課題】電極端子からの熱逃げを効果的に抑制できるウエハ加熱装置を提供する。【解決手段】ウエハが載置される上面、および前記上面に向かい合う下面を有するウエハ保持台と、前記上面と前記下面との間で前記上面に平行な面内に配置された発熱体と、前記発熱体の一部に接する端面を有する電極端子と、を備え、前記電極端子の少なくとも一部が金属多孔体で構成されている、ウエハ加熱装置。【選択図】図１