ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

To provide an adhesive composition capable of forming a cured adhesive layer with superior flame retardancy and adhesive strength, and a film-like adhesive, an adhesive sheet, a semiconductor device and a method for producing a semiconductor device, each employing the adhesive composition.SOLUTION:...

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Bibliographische Detailangaben
Hauptverfasser:	UEMURA KAZUE, SAEKI NAOYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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