ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

To provide an adhesive composition capable of forming a cured adhesive layer with superior flame retardancy and adhesive strength, and a film-like adhesive, an adhesive sheet, a semiconductor device and a method for producing a semiconductor device, each employing the adhesive composition.SOLUTION:...

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Bibliographische Detailangaben
Hauptverfasser:	UEMURA KAZUE, SAEKI NAOYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide an adhesive composition capable of forming a cured adhesive layer with superior flame retardancy and adhesive strength, and a film-like adhesive, an adhesive sheet, a semiconductor device and a method for producing a semiconductor device, each employing the adhesive composition.SOLUTION: An adhesive composition contains a thermoplastic component (A), a thermosetting component (B) and a nitrogen atom-containing flame retardant (C). The content of the nitrogen atom-containing flame retardant (C) is 25 mass% or less relative to the total amount (100 mass%) of components in the solids of the adhesive composition, excluding inorganic fillers. Also provided are a film-like adhesive, an adhesive sheet, a semiconductor device and a method for producing a semiconductor device, each employing the adhesive composition.SELECTED DRAWING: Figure 1 【課題】難燃性及び接着性に優れる硬化接着剤層を形成できる接着剤組成物、該接着剤組成物を用いたフィルム状接着剤、接着シート、半導体装置及び半導体装置の製造方法を提供する。【解決手段】熱可塑性成分（Ａ）、熱硬化性成分（Ｂ）及び窒素原子含有難燃剤（Ｃ）を含有する接着剤組成物であり、前記窒素原子含有難燃剤（Ｃ）の含有量が、前記接着剤組成物の固形分のうち無機充填材を除く成分の総量（１００質量％）に対して、２５質量％以下である、接着剤組成物、該接着剤組成物を用いたフィルム状接着剤、接着シート、半導体装置及び半導体装置の製造方法である。【選択図】図１