SUBSTRATE PROCESSOR AND METHOD FOR MOUNTING SUBSTRATE

To provide a technique of improving the distribution of stress of a substrate and properly holding the substrate.SOLUTION: A substrate processor has a holding unit including a circular center region and a toric outside region arranged on the outer side relative to the center region in an adsorption surface for adsorbing a substrate. The substrate processor includes: an adsorption pressure generation unit for generating individual adsorption pressures in the center region and in a plurality of zones divided along the peripheral direction of the outside region; and a deformation unit for relatively displacing the center region relative to the outer edge of the holding unit. The control unit of the substrate processor controls the steps of generating an adsorption pressure in at least a part of the plurality of zones of the outside region on the basis of the warpage state of the substrate and causing the substrate to be adsorbed to the adsorption surface (step A); and after the step (A), deforming the adsorption surface while continuing the step (A) (step B).SELECTED DRAWING: Figure 13 【課題】基板のストレスの分布を改善して、基板を適切に保持できる技術を提供する。【解決手段】基板処理装置は、基板を吸着する吸着面に、円状の中央領域と、中央領域よりも外側に配置される円環状の外側領域と、を有する保持部を備える。また、基板処理装置は、中央領域、および外側領域の周方向に沿って分割された複数のゾーンの各々に個別に吸着圧力を発生させる吸着圧力発生部と、保持部の外縁と相対的に中央領域を変位させる変形部と、を備える。基板処理装置の制御部は、（Ａ）基板の反り状態に基づき少なくとも外側領域の複数のゾーンの一部に吸着圧力を発生させて吸着面に基板を吸着させる工程と、（Ｂ）（Ａ）の工程の後、当該（Ａ）の工程を継続しながら吸着面を変形させる工程と、を制御する。【選択図】図１３