BONDED MEMBER MANUFACTURING DEVICE AND BONDED MEMBER MANUFACTURING METHOD

To provide a bonded member manufacturing device and a bonded member manufacturing method which can make the total thickness of manufactured bonded members uniform, even if members having an individual difference are bonded to each other.SOLUTION: A bonded member manufacturing device 1 includes: firs...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHOJI DAISUKE, SUDO MASAHIRO, OKAJI HIDEYUKI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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