BONDED MEMBER MANUFACTURING DEVICE AND BONDED MEMBER MANUFACTURING METHOD

To provide a bonded member manufacturing device and a bonded member manufacturing method which can make the total thickness of manufactured bonded members uniform, even if members having an individual difference are bonded to each other.SOLUTION: A bonded member manufacturing device 1 includes: firs...

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Bibliographische Detailangaben
Hauptverfasser:	SHOJI DAISUKE, SUDO MASAHIRO, OKAJI HIDEYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DYES FREQUENCY-CHANGING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-LINEAR OPTICS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES SPRAYING OR ATOMISING IN GENERAL TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a bonded member manufacturing device and a bonded member manufacturing method which can make the total thickness of manufactured bonded members uniform, even if members having an individual difference are bonded to each other.SOLUTION: A bonded member manufacturing device 1 includes: first and second holders 31 and 32; a distance adjustment device 35; a resin supply device 25 for supplying a liquid resin 83; a measuring instrument 21 for measuring values regarding thicknesses of first and second members 81 and 82; and a control device 50 for adjusting an amount of the resin 83 supplied to a first joined surface 91 and/or a second joined surface 92. The control device 50 controls the resin supply device 25 so as to supply the liquid resin 83 of an amount corresponding to a thickness of the resin 83 determined by subtracting the thickness of the first member 81 and the thickness of the second member 82 measured by the measurement instrument 21 from the total thickness that is a previously set thickness of the bonded member, to at least one of the first joined surface 91 and the second joined surface 92.SELECTED DRAWING: Figure 1 【課題】個体差を有する部材を貼合せた場合でも製造された貼合済部材の総厚さを一定にできる貼合済部材製造装置及び貼合済部材の製造方法を提供する。【解決手段】貼合済部材製造装置１は、第１及び第２の保持具３１、３２と、距離調節装置３５と、液状の樹脂８３を供給する樹脂供給装置２５と、第１及び第２の部材８１、８２の厚さに関する値を測定する測定器２１と、第１の接合面９１及び／又は前記第２の接合面９２に供給される樹脂８３の量を調節する制御装置５０とを備える。制御装置５０は、あらかじめ設定された貼合済部材の厚さである総厚さから測定器２１で測定された第１の部材８１の厚さ及び第２の部材８２の厚さを差し引いて求められる樹脂８３の厚さに相当する量の液状の樹脂８３を、第１の接合面９１及び第２の接合面９２の少なくとも一方に供給するように、樹脂供給装置２５を制御する。【選択図】図１