COMPOSITE ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF THE SAME
To provide a composite electronic component that can suppress unnecessary high frequency components that are superimposed on a transmission line of high frequency signals and a mounting structure of the same.SOLUTION: A composite electronic component 1 is a two-terminal composite electronic componen...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a composite electronic component that can suppress unnecessary high frequency components that are superimposed on a transmission line of high frequency signals and a mounting structure of the same.SOLUTION: A composite electronic component 1 is a two-terminal composite electronic component that is surface-mounted on a board 2, and includes a first terminal 6a, a second terminal 6b and a first body part 4 and a second body part 5 which are arranged in parallel between the first terminal 6a and the second terminal 6b. The first body part 4 includes an electrode layer 8 which is electrically connected to at least one of the first terminal 6a and the second terminal 6b, and a first member (dielectric layer DI) which is provided on the mounting surface side with respect to the electrode layer 8 between the first terminal 6a and the second terminal 6b. The second body part 5 includes a second member (magnetic material MG) which is provided between the first terminal 6a and the second terminal 6b. The relative dielectric constant of the second member is lower than that of the first member at the same frequency.SELECTED DRAWING: Figure 3
【課題】高周波信号の伝送線路に重畳する不要な高周波成分を抑制することができる複合電子部品及びその実装構造を実現する。【解決手段】複合電子部品1は、基板2に表面実装される2端子複合電子部品であって、第1端子6aと、第2端子6bと、第1端子6aと第2端子6bとの間に並列配置される第1本体部4及び第2本体部5と、を備える。第1本体部4は、第1端子6a及び第2端子6bのうちの少なくとも一方に電気的に接続される電極層8と、第1端子6aと第2端子6bとの間の電極層8よりも実装面側に設けられる第1部材(誘電体層DI)と、を有する。第2本体部5は、第1端子6aと第2端子6bとの間に設けられる第2部材(磁性体MG)を有する。第2部材は、同一周波数において第1部材よりも比誘電率が低い。【選択図】図3 |
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