PHOTOSENSITIVE TRANSFER MATERIAL, RESIN PATTERN PRODUCTION METHOD, CIRCUIT WIRING PRODUCTION METHOD, TOUCH PANEL PRODUCTION METHOD, AND POLYETHYLENE TEREPHTHALATE FILM

To provide a photosensitive transfer material that enables the production of a resin pattern with reduced defects, a resin pattern production method, a circuit wiring production method, and a touch panel production method which use the photosensitive transfer material, and a polyethylene terephthala...

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Bibliographische Detailangaben
Hauptverfasser: MOROZUMI KAZUMA, FUJIMOTO SHINJI, ARITOMI TAKASHI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a photosensitive transfer material that enables the production of a resin pattern with reduced defects, a resin pattern production method, a circuit wiring production method, and a touch panel production method which use the photosensitive transfer material, and a polyethylene terephthalate film.SOLUTION: Provided are: a photosensitive transfer material comprising a temporary support and a photosensitive resin layer disposed on the temporary support, wherein the number of foreign substances with a long diameter of 3 μm or longer included in the temporary support is at most 0.5/mm2; and applications for the photosensitive transfer material.SELECTED DRAWING: None 【課題】欠陥が低減された樹脂パターンを製造できる感光性転写材料、上記感光性転写材料を用いた樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法、並びに、ポリエチレンテレフタレートフィルムを提供する。【解決手段】仮支持体と、仮支持体上に配置された感光性樹脂層とを備え、仮支持体に含まれる長径3μm以上の異物の個数が0.5個/mm2以下である、感光性転写材料及びその応用。【選択図】なし