GAME MACHINE
To provide a game machine capable of reducing manufacturing costs.SOLUTION: Multiple surface mount components and multiple dip mount components are mounted on a main control board having a main control section, the multiple surface mount components include a first integrated circuit (IC3) connected...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a game machine capable of reducing manufacturing costs.SOLUTION: Multiple surface mount components and multiple dip mount components are mounted on a main control board having a main control section, the multiple surface mount components include a first integrated circuit (IC3) connected to a microprocessor of the main control section and a second integrated circuit (IC5) connected to a microprocessor of a game value control section, the first integrated circuit and the second integrated circuit have multiple terminals each, multiple terminals of the first integrated circuit are connected to multiple terminals of the second integrated circuit by wiring, respectively, a test point is provided for each of wiring for connecting the multiple terminals of the first integrated circuit and the multiple terminals of the second integrated circuit, the surface mount components have a surface area exceeding a predetermined size, and the microprocessor of the main control section and the microprocessor of the game value control section are in the same configuration.SELECTED DRAWING: Figure 41
【課題】製造コストの削減を図ることができる遊技機を提供する。【解決手段】主制御部を備える主制御基板に、複数の表面実装部品と、複数のディップ実装部品とを実装し、複数の表面実装部品は、主制御部のマイクロプロセッサに接続された第1の集積回路(IC3)と、遊技価値制御部のマイクロプロセッサに接続された第2の集積回路(IC5)とを含み、第1の集積回路及び第2の集積回路はそれぞれ複数の端子を有し、第1の集積回路の複数の端子と第2の集積回路の複数の端子との間がそれぞれ配線で接続され、第1の集積回路の複数の端子と第2の集積回路の複数の端子との間を接続する配線のそれぞれに対してテストポイントを設け、表面実装部品は、いずれもその表面積が所定サイズを超えるものであり、主制御部のマイクロプロセッサと遊技価値制御部のマイクロプロセッサとは同一の構成とする。【選択図】図41 |
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