BALL MOUNTING DEVICE AND BALL MOUNTING METHOD

To provide a ball mounting device and a ball mounting method capable of mounting conductive balls without ball mounting defects on a substrate having a large ball mounting area and an arrangement pattern of pad electrodes in which minute-diameter conductive balls are densely arranged.SOLUTION: A flu...

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Bibliographische Detailangaben
1. Verfasser:	KOTAKE TOSHIYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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