SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID COMPOSITION

To provide a solid composition having a low linear expansion coefficient and excellent moldability, a circuit board, and a method for producing a solid composition.SOLUTION: A solid composition contains a perfluoro-based fluororesin and an anisotropic filler that is surface-treated using a silane co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAWAKI KYOHEI, UEDA YUKI, OKUNO SHINGO, TATEMICHI MAYUKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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