SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID COMPOSITION

To provide a solid composition having a low linear expansion coefficient and excellent moldability, a circuit board, and a method for producing a solid composition.SOLUTION: A solid composition contains a perfluoro-based fluororesin and an anisotropic filler that is surface-treated using a silane co...

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Bibliographische Detailangaben
Hauptverfasser:	SAWAKI KYOHEI, UEDA YUKI, OKUNO SHINGO, TATEMICHI MAYUKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a solid composition having a low linear expansion coefficient and excellent moldability, a circuit board, and a method for producing a solid composition.SOLUTION: A solid composition contains a perfluoro-based fluororesin and an anisotropic filler that is surface-treated using a silane coupling agent.SELECTED DRAWING: None 【課題】線膨張率が低く、かつ成形性が良好な固体組成物、回路基板、及び、固体組成物の製造方法を提供する。【解決手段】パーフルオロ系フッ素樹脂と、シランカップリング剤で表面処理された異方性フィラーとを含有する固体組成物。【選択図】なし