SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

To suppress the deterioration of insulation quality between an electrode portion and a cooler.SOLUTION: Electric power conversion equipment includes a heat sink 1, an insulating resin sheet 3 laminated on the heat sink 1, an electrode portion 4 in which the lower surface 4a thereof is abutted on the...

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Hauptverfasser: HIRAI NAOTO, YATABE KO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To suppress the deterioration of insulation quality between an electrode portion and a cooler.SOLUTION: Electric power conversion equipment includes a heat sink 1, an insulating resin sheet 3 laminated on the heat sink 1, an electrode portion 4 in which the lower surface 4a thereof is abutted on the insulating resin sheet 3 and the upper surface 4b thereof opposite to the lower surface 4a is joined to a semiconductor chip 6, and a resin frame 5 which holds the electrode portion 4 in such a state that the resin frame 5 is closely adhered to the electrode portion 4 while at least a part of each of the lower surface 4a and the upper surface 4b are exposed.SELECTED DRAWING: Figure 2 【課題】電極部と冷却器との絶縁性の低下を抑制する。【解決手段】電力変換装置であって、放熱器1と、放熱器1に積層された絶縁樹脂シート3と、下面4aが絶縁樹脂シート3に当接されると共に、下面4aと反対側の上面4bに半導体チップ6が接合される電極部4と、下面4a及び上面4bの各々の少なくとも一部を露出した状態で、電極部4に対して密着した状態で電極部4を保持する樹脂枠5とを備える。【選択図】図2