LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

To provide a laser processing device and a laser processing method that can efficiently remove a molten material generated by laser processing.SOLUTION: A laser processing device includes: a laser part which generates a focused laser beam and irradiates a processing object with the laser beam; an ex...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YUTANI TAICHI, KUMANO TOMOMITSU, KUROSAWA KOICHI, HIMI FUTOSHI, NAKAI TAKAHIRO, WADA KATSUHIKO
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide a laser processing device and a laser processing method that can efficiently remove a molten material generated by laser processing.SOLUTION: A laser processing device includes: a laser part which generates a focused laser beam and irradiates a processing object with the laser beam; an explosion inducer supply part which supplies an explosion inducer to a processing part generated on the processing object with the laser beam from the laser part; and a control part which controls the laser beam from the laser part and the explosion inducer from the explosion inducer supply part. The laser processing device removes a molten material with the explosion generated by supplying the explosion inducer to the molten material generated in the processing part.SELECTED DRAWING: Figure 1 【課題】レーザ加工により生じた溶融物を効率的に除去可能なレーザ加工装置及びレーザ加工方法を提供する。【解決手段】収束したレーザ光を生成して加工対象物に照射するレーザ部と、レーザ部からのレーザ光により加工対象物に生成された加工部に、爆発誘発剤を供給する爆発誘発剤供給部と、レーザ部からのレーザ光と爆発誘発剤供給部からの爆発誘発剤を制御する制御部を備え、加工部に生成された溶融物に爆発誘発剤を供給したことにより生じる爆発により溶融物を除去することを特徴とするレーザ加工装置。【選択図】図1