WIRING STRUCTURE, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING STRUCTURE, AND ELECTRONIC MODULE

To provide a wiring structure capable of reducing possibility of loss of signal power and accurately and stably mounting a substrate on a pedestal.SOLUTION: A wiring structure includes: a wall portion; a first connection terminal; a substrate; a conductor portion; and a pedestal portion. The wall portion has a first wall surface. The first connection terminal protrudes from the first wall surface in a first direction. The substrate has: a first substrate opening that is open toward a first upper surface; and a first substrate side surface that is connected to the first upper surface. The pedestal portion includes a first pedestal opening that is open toward a second upper surface. The substrate is located on the second upper surface. The conductor portion includes a first signal conductor and a first ground conductor located on the first upper surface. The first signal conductor includes a first connection portion electrically connected to the first connection terminal in a plan view. The first substrate opening is located between the first connection portion and the first ground conductor. The first pedestal opening overlaps with the first connection portion in a plan view. The first substrate side surface is in contact with the first wall surface.SELECTED DRAWING: Figure 2 【課題】 信号電力が損失する可能性を低減でき、基板を精度よく安定して台座に実装可能な配線構造体を提供すること。【解決手段】 配線構造体は、壁部と、第１接続端子と、基板と、導体部と、台座部と、を備える。壁部は、第１壁面を有する。第１接続端子は、第１壁面から第１方向に突出している。基板は、第１上面に開口する第１基板開口部と、第１上面に接続する第１基板側面と、を有する。台座部は、第２上面に開口する第１台座開口部と、を有する。基板は、第２上面上に位置する。導体部は、第１上面に位置する第１信号導体および第１接地導体を有する。第１信号導体は、平面視で、第１接続端子と電気的に接続する第１接続部を有する。第１基板開口部は、第１接続部と第１接地導体との間に位置する。第１台座開口部は、平面視で、第１接続部と重なる。第１基板側面は、第１壁面と接している。【選択図】 図２