ENCAPSULATING EPOXY RESIN COMPOSITION FOR BALL GRID ARRAY PACKAGE, CURED EPOXY RESIN OBJECT, AND ELECTRONIC COMPONENT/DEVICE

To provide an encapsulating epoxy resin composition for ball grid array (BGA) package which is excellent in flowability, as well as, excellent in thermal conductivity when being cured, a cured epoxy resin product obtained by curing the epoxy resin composition, and an electronic component/device havi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHIBASHI KENTA, YAMAURA ITARU, TANAKA MIKA, KANG DONGOL, HORI KEICHI, KODAMA TAKUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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