ENCAPSULATING EPOXY RESIN COMPOSITION FOR BALL GRID ARRAY PACKAGE, CURED EPOXY RESIN OBJECT, AND ELECTRONIC COMPONENT/DEVICE

To provide an encapsulating epoxy resin composition for ball grid array (BGA) package which is excellent in flowability, as well as, excellent in thermal conductivity when being cured, a cured epoxy resin product obtained by curing the epoxy resin composition, and an electronic component/device having elements encapsulated with the cured epoxy resin product.SOLUTION: An encapsulating epoxy resin composition for a BGA package contains an epoxy resin, a phenol curing agent having a hydroxyl equivalent of 120 g/eq or less, and an inorganic filler containing alumina particles and silica particles, wherein a content of the inorganic filler is 65 vol.% to 85 vol.%, and a ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10 to 15 mass%.SELECTED DRAWING: None 【課題】流動性に優れ、硬化したときの熱伝導性に優れるＢＧＡパッケージ封止用エポキシ樹脂組成物、前記エポキシ樹脂組成物を硬化してなるエポキシ樹脂硬化物、並びに前記エポキシ樹脂硬化物によって封止された素子を備える電子部品装置を提供する【解決手段】ＢＧＡパッケージ封止用エポキシ樹脂組成物は、エポキシ樹脂と、水酸基当量１２０ｇ／ｅｑ以下のフェノール硬化剤と、アルミナ粒子及びシリカ粒子を含む無機充填材と、を含有し、前記無機充填材の含有率が６５体積％～８５体積％であり、前記アルミナ粒子及び前記シリカ粒子の合計量に対する前記シリカ粒子の割合が１０質量％～１５質量％である。【選択図】なし