PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN LAMINATE

To provide a photosensitive resin composition which can improve properties relating to dissolution of peeled chips and plating slipping, and a photosensitive resin laminate using the same, and a resist pattern or semiconductor bump formation method.SOLUTION: There is provided a photosensitive resin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAJIRI TONAMI, YAMADA TERUHISA, KOSAKA JUNYA, KUNIMATSU SHINICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!