PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN LAMINATE

To provide a photosensitive resin composition which can improve properties relating to dissolution of peeled chips and plating slipping, and a photosensitive resin laminate using the same, and a resist pattern or semiconductor bump formation method.SOLUTION: There is provided a photosensitive resin laminate in which a photosensitive resin layer containing a photosensitive resin composition containing 10 to 90 mass% of (A) an alkali-soluble polymer, 5 to 70 mass% of (B) a compound having an ethylenically unsaturated bond, and 0.01 to 20 mass% of (C) a photopolymerization initiator is laminated on a support film, wherein (A) the alkali-soluble polymer contains a copolymer having (meth)acrylate having an alkyl group having 3 to 12 carbon atoms as a copolymerization component, 51 to 100 mass% of an acrylate monomer as (B) the compound having the ethylenically unsaturated bond is contained with respect to the total amount of the (B), when film thickness of the photosensitive resin layer is represented by T (μm) and an absorbance at a wavelength of 365 nm is represented by A, T and A satisfy 0