MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
To provide a manufacturing method of a semiconductor device capable of suppressing the cost of a production facility.SOLUTION: A manufacturing method of a semiconductor device according to the present invention includes: a punching step of punching out multiple types of solder foils for bonding from...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a manufacturing method of a semiconductor device capable of suppressing the cost of a production facility.SOLUTION: A manufacturing method of a semiconductor device according to the present invention includes: a punching step of punching out multiple types of solder foils for bonding from a solder sheet 10 having a short side direction and a long side direction; and a bonding step of bonding the solder foils for bonding to a wafer. At least one type of the multiple types of solder foils for bonding has: an arc portion 51 with a diameter d1 larger than a length in the short side direction of the solder sheet 10; and a straight portion 52 approximately parallel to the long side direction of the solder sheet 10. A diameter of the arc portion 51 is the same as a diameter of the wafer to be bonded.SELECTED DRAWING: Figure 1
【課題】生産設備のコストを抑制することができる半導体装置の製造方法を提供する。【解決手段】本発明の半導体装置の製造方法は、短手方向と長手方向を有するはんだシート１０から複数種類の接合用はんだ箔を打ち抜く打ち抜き工程と、接合用はんだ箔とウエハとを接合する接合工程とを有する。複数種類の接合用はんだ箔の少なくとも１種類は、はんだシート１０の短手方向の長さよりも大きい直径ｄ１の円弧部５１と、はんだシート１０の長手方向に略平行な直線部５２とを有する。そして、円弧部５１の径は、接合するウエハの径と同じである。【選択図】図１ |
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