SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

To provide a substrate processing method and a substrate processing system for forming a metal layer on a surface of a conductor in a substrate on which a pattern of the conductor and an insulator is formed.SOLUTION: A substrate processing method includes: the steps of preparing a substrate having a substrate surface on which a pattern of a conductor and an insulator is formed; applying ion liquid containing metal salt to the substrate surface of the substrate; and applying energy to the substrate on which the ion liquid was applied. The step of applying energy to the substrate deposits metal of the metal salt on a surface of the conductor due to reductive reaction of the metal salt to form a metal layer on the surface of the conductor.SELECTED DRAWING: Figure 6 【課題】導電体と絶縁体のパターンが形成された基板おいて、導電体の表面に金属層を形成する基板処理方法及び基板処理システムを提供する。【解決手段】基板表面に導電体と絶縁体のパターンが形成された基板を準備する工程と、前記基板の前記基板表面に、金属塩を含むイオン液体を塗布する工程と、前記イオン液体が塗布された前記基板にエネルギーを加える工程と、を有し、前記基板にエネルギーを加える工程は、前記金属塩の還元反応により前記導電体の表面に前記金属塩の金属を析出させ、前記導電体の表面に金属層を形成する、基板処理方法。【選択図】図６