TEMPERATURE CONTROL METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, TEMPERATURE CONTROL SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM

To provide a temperature control method, a temperature control system, a substrate processing apparatus, and a program that are capable of suppressing the effect of temperature fluctuations caused by the movement of a temperature sensor on temperature control in a processing space.SOLUTION: A substr...

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Hauptverfasser:	YAMAGUCHI HIDETO, NAKANISHI KENTO, SHIGEMATSU SEIYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE METALLURGY PHYSICS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:	To provide a temperature control method, a temperature control system, a substrate processing apparatus, and a program that are capable of suppressing the effect of temperature fluctuations caused by the movement of a temperature sensor on temperature control in a processing space.SOLUTION: A substrate processing apparatus 10 controls the temperature of a substrate using a moving average value calculated by performing moving average processing on a temperature detection value of a temperature sensor (substrate thermocouple) 211 that is rotatably provided together with a holder (boat 31) that holds the substrate (wafer) 1. The moving average calculation is determined by a moving average parameter for each step, and the moving average parameter is set according to the boat rotation speed.SELECTED DRAWING: Figure 2 【課題】処理空間内の温度制御方法で、温度センサの運動に伴う温度揺らぎの温度制御への影響を抑制することができる温度制御方法、温度制御システム、基板処理装置及びプログラムを提供する。【解決手段】基板処理装置１０は、基板（ウェハ）１を保持する保持具（ボート３１）と共に回転可能に設けられる温度センサ（基板熱電対）２１１の温度検出値を移動平均処理することにより算出される移動平均値を用いて、基板の温度を制御する。移動平均値算出は、ステップ毎に移動平均パラメータにより決定され、ボート回転速度に応じて、移動平均パラメータを設定する。【選択図】図２