SOLDER PROCESSING DEVICE

To provide a solder processing device that can perform the decomposition of dross more effectively compared to a conventional mode.SOLUTION: A solder processing device includes: a reservoir 110 which stores molten solder; and an extension part 210 which at least partially extends in the molten solde...

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Bibliographische Detailangaben
Hauptverfasser:	SHINOHARA KATSUHIRO, YADERA NORIO, KAGAYA TOMOTAKE, KAWASHIMA TAIJI, TAGUCHI HIROSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a solder processing device that can perform the decomposition of dross more effectively compared to a conventional mode.SOLUTION: A solder processing device includes: a reservoir 110 which stores molten solder; and an extension part 210 which at least partially extends in the molten solder in the reservoir 110 and reciprocates in the horizontal direction in the molten solder while changing the position in the vertical direction.SELECTED DRAWING: Figure 2 【課題】従来の態様と比べ、ドロスの分解をより効果的に行うことができるはんだ処理装置を提供する。【解決手段】はんだ処理装置は、溶融はんだを収容する貯留槽１１０と、前記貯留槽１１０内の溶融はんだ内で少なくとも一部が延在し、上下方向の位置を変えつつ、溶融はんだ内において水平方向で往復移動する延在部２１０と、を有する。【選択図】図２