GRINDING METHOD

To continuously and excellently grind a workpiece by stably consuming a grinding stone with self-sharpening without the need for modification of a grinding device or replacement of a grinding wheel.SOLUTION: A grinding method includes: a holding step of holding a wafer (workpiece) W at a position that does not overlap a rotational axis CL1 of a chuck table 10; and a grinding step of grinding the wafer W by rotating grinding stones 25b and the chuck table 10 and bringing the grinding stones 25b and the chuck table 10 into relatively close to each other in such a state where the grinding stones 25b are located at positions where the rotation trajectories of the grinding stones 25b of a grinding unit including the grinding wheel 25 having the grinding stones 25b that are annularly arranged overlap the rotational axis CL1. In the grinding step, the wafer W moves so as to travel between the inner side and the outer side of the annular grinding stones 25b by the rotation of the chuck table 10, and the grinding stones 25b grind the wafer W while repeating grinding and non-grinding.SELECTED DRAWING: Figure 3 【課題】研削装置の改造や研削ホイールの交換などを要することなく、研削砥石を自生発刃によって安定消耗させることによって被加工物を連続して良好に研削すること。【解決手段】チャックテーブル１０の回転軸ＣＬ１と重ならない位置にウェーハ（被加工物）Ｗを保持する保持ステップと、環状に配置された研削砥石２５ｂを有する研削ホイール２５を備える研削ユニットの研削砥石２５ｂの回転軌跡が回転軸ＣＬ１と重なる位置に研削砥石２５ｂを位置づけた状態で、研削砥石２５ｂとチャックテーブル１０とを回転させるとともに該研削砥石２５ｂとチャックテーブル１０とを相対的に接近させることによってウェーハＷを研削する研削ステップとを備え、研削ステップは、チャックテーブル１０の回転によって、ウェーハＷが環状の研削砥石２５ｂの内側と外側を行き来するように移動し、該研削砥石２５ｂが研削と非研削を繰り返しながらウェーハＷを研削する。【選択図】図３