COOLING CASE AND COLD PLATE STRUCTURE FOR COOLING PRINTED CIRCUIT BOARD

To provide a cooling case and cold plate capable of lowering temperature rise even with high thermal load.SOLUTION: A printed circuit board cold plate (cooling plate) structure consists of a cooling case 10 that internally cools the printed circuit board (PCB) with air or fluid and a slot 11 that is...

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Bibliographische Detailangaben
Hauptverfasser:	MURAT PARLAK, VEDAT YAGCI, AHMET SAHIN SEN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a cooling case and cold plate capable of lowering temperature rise even with high thermal load.SOLUTION: A printed circuit board cold plate (cooling plate) structure consists of a cooling case 10 that internally cools the printed circuit board (PCB) with air or fluid and a slot 11 that is located in the case 10 and opens into the relevant board area of the case 10, transfers heat to the chassis (case) wall, and removes high thermal loads from a cold plate 20. It also eliminates the need for a wedge mechanism.SELECTED DRAWING: Figure 5 【課題】熱負荷が高くとも温度上昇を低くすることが可能な冷却ケース及びコールドプレートを提供すること。【解決手段】プリント回路基板のコールドプレート（冷却板）構造体は、内部でプリント回路基板（ＰＣＢ）を空気又は流体によって冷却する冷却ケース１０と、ケース１０内に配置され、ケース１０の関連基板領域内に開口するスロット１１により構成され、シャーシ（ケース）壁に熱を伝達し、コールドプレート２０から高熱負荷を取り除く。また、ウェッジ機構を不要にする。【選択図】図５