RESIN HAVING ACID GROUP AND POLYMERIZABLE UNSATURATED GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, RESIN MATERIAL FOR SOLDER RESIST, INSULATION MATERIAL AND RESIST MEMBER

To provide a resin having an acid group and a polymerizable unsaturated group which exhibits high insulation reliability and high heat resistance when being cured, and is excellent in cold-hot shock resistance, and a curable resin composition containing the resin, a cured product of the curable resi...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA YUMIKO, YAMADA SHUNSUKE, KAMEYAMA YASUSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a resin having an acid group and a polymerizable unsaturated group which exhibits high insulation reliability and high heat resistance when being cured, and is excellent in cold-hot shock resistance, and a curable resin composition containing the resin, a cured product of the curable resin composition, a resin material for a solder resist, an insulation material and a resist member.SOLUTION: A resin having an acid group and a polymerizable unsaturated group contains a phenolic resin (A) having a phenolic hydroxyl group, a (meth)acrylate compound (B) having an epoxy group and a polybasic acid anhydride (C) as essential reaction raw materials (1), wherein a chlorine atom content in the resin having the acid group and the polymerizable unsaturated group is 100 mass ppm or less.SELECTED DRAWING: None 【課題】本開示は、硬化した際に、高い絶縁信頼性及び高い耐熱性を示し、かつ耐冷熱衝撃性に優れた酸基及び重合性不飽和基を有する樹脂、並びに当該樹脂を含有する硬化性樹脂組成物、前記硬化性樹脂組成物の硬化物、ソルダーレジスト用樹脂材料、絶縁材料及びレジスト部材を提供することを目的とする。【解決手段】本開示は、フェノール性水酸基を有するフェノール系樹脂（Ａ）と、エポキシ基を有する（メタ）アクリレート化合物（Ｂ）と、多塩基酸無水物（Ｃ）とを必須の反応原料（１）とする酸基及び重合性不飽和基を有する樹脂であって、前記酸基及び重合性不飽和基を有する樹脂中の塩素原子含有量が１００質量ｐｐｍ以下であることを特徴とする、酸基及び重合性不飽和基を有する樹脂である。【選択図】なし