THIXOTROPICALLY MOLDED PRODUCT

To provide a thixotropically molded product with high vibration damping capacity.SOLUTION: A thixotropically molded product includes: a matrix portion containing Mg as a main component; a C particle portion dispersed in the matrix portion and containing C as a main component; a first Mg particle por...

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Bibliographische Detailangaben
Hauptverfasser: HIDESHIMA YASUTOSHI, IWASHITA SETSUYA, MAEDA IKUYA, OZAKI KOICHI, UCHIZONO SHUNSUKE, FUKUDA TADAO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a thixotropically molded product with high vibration damping capacity.SOLUTION: A thixotropically molded product includes: a matrix portion containing Mg as a main component; a C particle portion dispersed in the matrix portion and containing C as a main component; a first Mg particle portion dispersed in the matrix portion and containing Mg2Si; and a second Mg particle portion dispersed in the matrix portion and containing MgO, where the C content is from 3.0 mass% to 40.0 mass% inclusive. By observing a cross section, the total area fraction of the first and second Mg particle portions in the range of a 500 μm square around a point at a depth of 1 mm from a surface is from 0.05% to 10.0% inclusive.SELECTED DRAWING: Figure 1 【課題】高い振動減衰性を有するチクソ成形体を提供すること。【解決手段】Mgを主成分とするマトリックス部と、前記マトリックス部中に分散し、Cを主成分とするC粒子部と、前記マトリックス部中に分散し、Mg2Siを含む第1Mg粒子部と、前記マトリックス部中に分散し、MgOを含む第2Mg粒子部と、を有し、Cの含有率が3.0質量%以上40.0質量%以下であることを特徴とするチクソ成形体。また、断面を観察し、表面からの深さが1mmの点を中心とする500μm角の範囲における前記第1Mg粒子部および前記第2Mg粒子部の合計の面積分率が0.05%以上10.0%以下であることが好ましい。【選択図】図1