SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

To provide a substrate processing method and a substrate processing apparatus capable of controlling the shape of a recess.SOLUTION: A substrate processing method according to an exemplary embodiment includes a step (a) of providing a substrate including a first film and a mask disposed on the first...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU FANGHUA, LIAO JINGCHENG, LU YUFEN, CHEN JIE NAN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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